TSMC (TSM) news that moved the stock

What happened

Taiwan's government moved over the weekend to arrest the rout in its stock market, and the measures took effect on Monday, November 9. The Financial Supervisory Commission cut the cap on intraday short-sale orders for borrowed shares to 3% of a stock's 30-day average daily volume, down from 30%, and raised the minimum margin for short sales to 130% from 90%, while encouraging buybacks. At an emergency meeting on Friday afternoon, the National Financial Stabilization Fund authorized its tenth-ever market-rescue operation, putting NT$500 billion (about $15 billion) on standby to buy stocks. The Taiex surged as much as 6.7% intraday and stood up 5.79% at 42,001.22 in midday trading, its biggest one-day gain since July 31, ending a seven-session losing streak; TSMC gained about 4.7%, MediaTek more than 4% and Foxconn about 6.5%. South Korea acted in parallel, suspending the margin-loan collateral rule that forces brokers to liquidate leveraged retail accounts; SK Hynix gained about 4.6% and Samsung about 2.4%. Nasdaq 100 futures, down about 0.8% at Sunday's open on the Nvidia probe news, recovered to roughly flat by Monday morning.

What happened

Taiwan Semiconductor Manufacturing Co. (TSMC) is preparing to raise prices for its CoWoS (Chip on Wafer on Substrate) advanced packaging services by 10% to 20%, according to Taiwan's Commercial Times (also cited as China Times), which cited supply-chain sources. CoWoS packages AI processors together with high-bandwidth memory (HBM) into a single unit, and it is the packaging technology used in most advanced AI accelerators. The report says foundries and outsourced assembly-and-test providers are preparing the increases as demand for advanced packaging expands beyond GPUs to server CPUs and custom AI chips (ASICs), while longer AI chip testing times and equipment lead times stretching from 3-6 months to 6-8 months tighten capacity further.

What happened

Samsung Electronics will use TSMC's 3-nanometre process to produce the base dies for Nvidia's next-generation custom high-bandwidth memory (NVHBM) chips, the Seoul Economic Daily reported on Sunday, as carried by Reuters. It would be the first time Samsung has worked with TSMC at the HBM manufacturing stage. Nvidia has asked all three of its HBM suppliers — Samsung, SK Hynix and Micron — to use TSMC's process for NVHBM base dies and sixth-generation (1c) DRAM technology for the core dies. Samsung accepted Nvidia's requirements after an internal review, while planning to retain its in-house production model for standard HBM and custom products for other customers, and is assessing whether its own foundry could produce NVHBM base dies if demand exceeds TSMC's capacity.

What happened

ASML reported third-quarter net profit of 4.96 billion euros ($5.55 billion), more than double the 2.92 billion euros a year earlier and well above the ~4.2 billion euro consensus, on record net sales of 11.66 billion euros. Sales came in slightly below the ~11.72 billion euro consensus, but gross margin of 57.5% beat guidance. ASML raised its full-year sales outlook for a third time in 2026, to 44-45 billion euros from 43-45 billion, and guided Q4 sales of 14.2-15.2 billion euros, above expectations. CEO Christophe Fouquet said customers keep raising short- and medium-term equipment demand forecasts on AI investment, with some expressing interest in orders for 2029 and even 2030, and that planned supply for 2027 and 2028 will not fully meet customer demand.

What happened

GlobalFoundries announced on Oct 8, 2026 that it has signed a $2 billion, five-year manufacturing agreement with TSMC to produce silicon interposers at its Malta, New York facility. A silicon interposer is the thin, high-speed connector substrate that sits beneath processors and memory chips inside advanced AI packages (notably TSMC's CoWoS ecosystem), letting them communicate at high speeds. GF will expand capacity at Malta to make interposers tailored for TSMC's CoWoS packaging — including embedded deep trench capacitor components — and expects to become the first U.S.-based source of silicon interposers for advanced packaging. Volume production is expected to begin ramping in the first half of 2028, and the agreement provides a framework for future capacity expansion. GFS shares jumped ~6% Thursday morning to about $51, bucking a broader market selloff, while TSMC reported record Q3 revenue of $46.71B (+50% y/y) the same day.

What happened

Elon Musk confirmed on Saturday in an X post that Taiwan Semiconductor (TSMC) is in discussions to join his Terafab chip venture, writing 'Just discussions, but something may come of it' in response to a report from Asian tech Substack Culpium saying TSMC was exploring how to help run Terafab's Texas semiconductor factories. Intel shares slid about 3.7-4% premarket to $114.95 on Monday, snapping a run that had the stock up 25% over the prior month, while TSMC's U.S. shares climbed 1.8% and its Taiwan shares rose ~3%. Oppenheimer semiconductor analyst Rick Schafer wrote Monday that Intel is currently slated to supply its 14A process to Terafab — 'a role TSMC's own nodes could replace' — with one option having TSMC own and run a fab serving only Tesla, SpaceX, and xAI while SpaceX invests or commits volume. Musk later acknowledged that any TSMC chips would likely supplement, not replace, Intel's role.